Complete semiconductor wafer foundry production line, designed annual capacity of 25,000 pieces. Process capabilities cover wafer front to back thinning cutting processes to support MPW/SPW wafers and various test requirements. The advanced process equipment provides customers with flexible short-process foundry services, such as narrow line width lithography, wafer thinning, back hole etching, wafer cutting, etc. Abundant production capacity to meet the needs of customers in large quantities, and to support customers in the research and development stage of a small number of diverse foundry needs.